교수진
허주열
- 직위
- 교수
- 전화번호
- 02-3290-3278
- 연구분야
- 미세조직 형성거동의 상평형장 전산모사 저온형 고체산화물 연료전지(SOFC)의 Fe-Cr계 금속분리판 개발 전자패키징의 무연 솔더조인트 신뢰성 향상 연구
- 사무실
- 공학관 621호
- 이메일
- jyhuh@korea.ac.kr
학력
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1979.3 - 1983.2 서울대학교 공과대학 금속공학과 (공학사) 1983.3 - 1985.2 서울대학교 공과대학 금속공학과 (공학석사) 1986.9 - 1993.4 Carnegie Mellon Univ. 재료공학전공 (공학박사)
경력 및 수상
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1993.9 - 1995.2 Max Planck Institute for Microstructure Physics. Post-Doctoral Fellow 1995.3 - 1996.1 한국과학기술연구원. 선임연구원 1996.3 - 1999.2 고려대학교 재료금속공학부 조교수 1999.3 - 현 재 고려대학교 재료공학부, 부교수 1996.7 ? 1996.8 Max Planck Institute for Microstructure Physics. Visiting Scholar
연구논문
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1. S.T. Kim and J.Y. Huh, "Enhanced Growth Kinetics of Intermetallic Compounds between Bi-containing Sn-3.5Ag Solders and Cu Substrate during Aging", Materials Science Forum, 475-479 2627-2630 (2005). 2. H.S. Lee, B. Cheong, T.S. Lee, K.S. Lee, W.M. Kim, and J.Y. Huh, "A Semiconducting Thermo-optic Material for Potential Application to Super-resolution optical Data Storage", Thin Solid Films, in press (2005). 3. J.Y. Huh, K.K. Hong, Y.B. Kim, and K.T. Kim, "Phase Field Simulations of Intermetallic Compound Growth during Soldering Reactions", J. Electron. Mater, 33(10), 1161-1169 (2004). 4. H.S. Lee, B. Cheong, T.S. Lee, K.S. Lee, W.M. Kim, J.W. Lee, S.H. Cho, and J.Y. Huh, "Thermoelectric PbTe Thin Film for Super-resolution Optical Data Storage", Appl. Phys. Lett., 84(14), 2782-2784 (2004). 5. J.Y. Huh, S.U. Han, and C.Y. Park, "Effect of Bismuth on the Growth Kinetics of Intermetallic Compounds in Sn-3.5Ag Solder Joints: A Growth Kinetic Model", Metals and Materials International, 10, 123-131 (2004). 6. W.C. Johnson and J.Y. Huh, "Thermodynamics of Stress-induced Interstitial Redistribution in BCC Metals", Metall. Mater. Trans. A, 34A, 2819-2825 (2003) 7. M.D. Chun, D. Kim, and J.Y. Huh, "Radiation-induced junction formation behavior of boron-doped Czochralski and float zone silicon crystals under 3 MeV proton irradiation", J. Appl. Phys. 94(9), 5617-5622 (2003). 8. W.C. Johnson, S.M. Wise, J.Y. Huh, J. Favergeon, "Effect of interfacial segregation on phase decomposition of a thin film on a patterned substrate", Metals and Materials, 9, 1-8 (2003). 9.C.K. Shin, Y.-J. Baik, and J.Y. Huh, "Effects of microstructural evolution and intermetallic layer growth on shear strength of ball-grid-array Sn-Cu solder joints", J. Electron. Mater., 30(5), 1323-1331 (2001). 10. J.Y. Huh and S.J. Moon, "Effect of elastic stresses on solid-state amorphization of Zr/Co multilayers", Thin Solid Films, 377-378, 611-616 (2000)